High Performance Center »Functional Integration in Micro- and Nanoelectronics«
The institutes within the High Performance Center Micro/Nano develop innovative technologies for highly integrated, heterogeneous electronic systems with overall package thicknesses of less than 500 µm. These technologies enable high-performance, ultra-compact solutions for forward-looking applications such as wearables, smart cards, foldable electronics, medical systems, and intelligent fiber-reinforced polymer composites for lightweight applications.
The focus is on complex sensor systems that bring together different components and technologies within an extremely small footprint. These include MEMS and MOEMS, sensors, integrated capacitors, signal-processing electronics, ASICs, and energy storage devices. Modular wafer-level integration concepts enable these components to be reliably combined into highly functional Wafer-Level System-in-Package (WL-SiP) solutions.
The technologies developed combine minimal package thickness, high functionality, and strong scalability – from prototyping through to small-series production. This enables customer-specific electronic solutions to be efficiently transferred to a wide range of applications, including electronics integrated into clothing, flexible and foldable electronics, and robust sensor systems embedded in composite materials.
The High Performance Center Micro/Nano supports companies throughout the entire development chain: from system conception and design through process and technology development to reliability assessment. For applications with medium integration densities, wafer-level packages also provide a cost-effective alternative to silicon interposers.
Your Benefits / Our Offering
- Presentation and demonstration of heterogeneous integration technologies
- Individual consulting for application- and customer-specific system solutions
- Integration of customer-specific circuits into customized 3D system designs
- Development and implementation of process technologies for 2.5D interposers
- Highly flexible process lines for heterogeneous integration on 200 mm and 300 mm wafers
- Wafer-level integration of passive and active components for compact, high-performance systems