Thin, Heterogeneous Sensor Systems

The performance center offers extensive technologies for the development of heterogeneous systems designed for applications requiring extremely low assembly height (<500 μm). Such low-profile integration is essential for use cases like wearable electronics—e.g., electronics embedded in clothing—as well as fiber-reinforced composites with integrated electronic components.

The main challenge in creating low-profile heterogeneous sensor systems lies in the integration of components manufactured using diverse technologies, such as MEMS, MOEMS, integrated capacitors, signal processing electronics, and batteries. Modular concepts for building these ultra-thin, complex sensor systems are being researched and implemented in practice.

With the available processes and technologies, applications such as smart cards, foldable electronics, fiber-reinforced lightweight structures, and wearables—which are currently attracting significant industrial interest—can be addressed through customer-specific development projects. Furthermore, this technology enables the development of wafer-level packages as a cost-effective alternative to silicon interposers for applications with medium integration density.