Workshop 3D/2.5D System Integration

High Performance Center Micro/Nano / December 31, 2027

Workshop 3D / 2.5D System Integration

2027 dates to be determined

Fraunhofer Institute for Integrated Circuits IIS – Division for Adaptive Systems Development EAS

Münchner Straße 16, 01187 Dresden

Visit the 3D / 2.5D System Integration Workshop — a compact, one-day workshop designed for electrical engineering professionals eager to learn about the latest developments in microelectronic system concepts.

Gain in-depth insights into 3D and 2.5D integration approaches, advanced miniaturization technologies, and innovative methods for developing powerful, compact electronic systems. Presentations will be delivered by experts from leading Fraunhofer institutes, offering practical knowledge directly from applied research. Take advantage of this opportunity to deepen your expertise and prepare for future challenges in microelectronics.

Programm - 2027 dates to be determined

Sprache: Englisch

Time	Program item	speaker
09:00 - 10:10	3D / 2.5D System Integration and Interposer Processes Trends in electronics packaging SoC and SiP concepts Introduction of 3D/2.5D SiP concepts Trends in application of 3D/2.5D Interposer types: Si, glass, organic Process flow for Si interposer and RDL first	Prof. Dr.-Ing. Juliana Panchenko, Institute of Electronics Packaging Technology, TU Dresden
10:10 - 10:30	Discussion & Break
10:30 - 11:40	Design for 3D / 2.5D Systems Design concepts – ideas behind a design Design tools and workflows – commercial software and tools, process steps Data handling (Assembly Design Kit) – managing and organizing design data and components Examples – practical applications or sample projects	Andy Heinig, Fraunhofer IIS
11:40 - 12:00	Discussion & Break
12:00 - 13:00	Lunch Break
13:00 - 14:00	Technologies and Materials for 3D / 2.5D Integration 3D SiT basic process flow TSV etching and thin layer deposition RDL and bump fabrication Fine-pitch bonding technologies	Prof. Dr.-Ing. Juliana Panchenko, Institute of Electronics Packaging Technology, TU Dresden
14:00 - 14:20	Discussion & Break
14:20 - 15:20	3D Lithography and 3D Printing Introduction to Two-Photon Lithography Special Features of IPMS Technology Latest Examples	Dr. Severin Schweiger, Fraunhofer IPMS
15:20 - 15:40	Discussion & Break
15:40 - 16:40	3D MEMS Packaging Overview and classification of packaging technologies in the field of MEMS Wafer-level bonding and stacking of substrates Integration technologies (wire bonding, flip-chip, die attach, …)	Frank Roscher, Fraunhofer ENAS
16:40 - 17:00	Discussion & End

Workshop 3D/2.5D System Integration

High Performance Center Micro/Nano / December 31, 2027