Fraunhofer Institute for Integrated Circuits IIS – Division for Adaptive Systems Development EAS
Münchner Straße 16, 01187 Dresden
Visit the 3D / 2.5D System Integration Workshop — a compact, one-day workshop designed for electrical engineering professionals eager to learn about the latest developments in microelectronic system concepts. Gain in-depth insights into 3D and 2.5D integration approaches, advanced miniaturization technologies, and innovative methods for developing powerful, compact electronic systems. Presentations will be delivered by experts from leading Fraunhofer institutes, offering practical knowledge directly from applied research. Take advantage of this opportunity to deepen your expertise and prepare for future challenges in microelectronics.
- Registration link coming soon -
Language: English
| Time | Program Item |
|---|---|
| 09:00 - 10:10 | 3D / 2.5D System Integration and Interposer Processes |
| 10:10 - 10:30 | Discussion & Break |
| 10:30 - 11:40 | Design for 3D / 2.5D Systems |
| 11:40 - 12:00 | Discussion & Break |
| 12:00 - 13:00 | Lunch Break |
| 13:00 - 14:00 | Technologies and Materials for 3D / 2.5D Integration: TSV, RDL, Fine-Pitch Bonding |
| 14:00 - 14:20 | Discussion & Break |
| 14:20 - 15:20 | 3D Lithography and 3D Printing |
| 15:20 - 15:40 | Discussion & Break |
| 15:40 - 16:40 | 3D MEMS Packaging |
| 16:40 - 17:00 | Discussion & End |
High Performance Center »Functional Integration in Micro- and Nanoelectronics«