Aktuelles

This year, the High Performance Center was represented at a joint booth by Fraunhofer IPMS and Fraunhofer IZM-ASSID. The two institutes showcased current research topics and results from the Performance Center in the field of micro- and nanotechnologies.

As of March 1, 2025, Dr. Christian Körner will take over the management of the administrative office of the Micro/Nano Performance Center. Dr. Frank Benner, who has held the coordination role until now, will move on to the Research Fab Microelectronics Germany (FMD). Dr. Christian Körner brings with him experience in network building, communicating complex technologies, market analysis, strategy development, and stakeholder communication—gained at the technology network Organic Electronics Saxony and in various roles at the deep tech startup SENORICS. He will enrich the Performance Center with fresh ideas and strategic vision to further advance joint research and development and to strengthen the transfer of results into the (regional) business landscape.

The High Performance Center Micro/Nano began a new three-year funding period in January to implement transfer activities in line with the defined roadmap. One focus is the joint, cross-institutional organization of workshops. In addition, three application- and transfer-oriented projects are being launched.

The pilot line for “Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems” (APECS) marks a major leap forward in strengthening Europe’s semiconductor manufacturing ca-pabilities and chiplet innovation as part of the EU Chips Act. By provid-ing large industry players, SMEs, and start-ups with a facilitated access to cutting-edge technology, the APECS pilot line will establish a strong foundation for resilient and robust European semiconductor supply chains. Within APECS, the institutes collaborating in the Research Fab Microelectronics Germany (FMD) will work closely with European partners, to make a significant contribution to the European Union´s goals of increasing technological resilience, strengthening cross-border collaboration and enhancing its global competitiveness in semiconduc-tor technologies. APECS is co-funded by the Chips Joint Undertaking and national funding authorities of Austria, Belgium, Finland, France, Germany, Greece, Portugal, Spain, through the “Chips for Europe” ini-tiative. The overall funding for APECS amounts to € 730 million over 4.5 years.