Technologies

The partners of the High Performance Center Micro/Nano cover the entire value chain of micro/nanoelectronics and microsystems technology — from design to pilot production and testing. With our extensive industry-level infrastructure, we are the ideal R&D partner for your product development and pre-competitive research. In addition, through the Research Fab Microelectronics Germany (FMD), we are embedded in a larger network of R&D services that spans the entire spectrum of electronics research in Germany.

Central Research Topics of the High Performance Center

The High Performance Center has established a cross-institute platform for the core competencies of system design, components & manufacturing technologies, system integration, and reliability assessment. These core competencies are applied in particular to address the following R&D topics of high industrial relevance.:

 

Materials & Processes

  • Test Wafers for Process Development in a Professional Cleanroom Environment
  • FEoL and BEoL Technologies & Analytics from a Single Source
 

Integration of Heterogeneous Systems

  • Ultra-Low Profile (<500 μm) with Modular Architecture
  • Development of Wafer-Level Packages
 

Sensors and Actuators

  • Materials, processes, components, scaling
  • Optical, acoustic, chemical & biological
  • Analytics and quality assurance
 

Integrated Connected Sensor Technology

  • Sensor integration and data fusion
  • From concept to system
  • Validation in a real-world laboratory test environment
 

Quantum Technologies

  • Cross-platform expertise in computing, communication, and sensing
  • Focus on scalability
 

Neuromorphic Computing

  • Devices and technologies
  • Circuits and architectures

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Contact

Dr. Christian Körner

Head of the Office

Fraunhofer IPMS, Maria-Reiche-Str. 2, 01109 Dresden, Germany
Phone: +49 351 8823-1515