High Performance Center »Functional Integration in Micro- and Nanoelectronics«
High Performance Center »Functional Integration in Micro- and Nanoelectronics«

Technologies

High Performance Center "Functional Integration in Micro- and Nanoelectronics"

Technologies

The partners of the High Performance Center Micro/Nano cover the entire value chain of micro/nanoelectronics and microsystems technology — from design to pilot production and testing. With our extensive industry-level infrastructure, we are the ideal R&D partner for your product development and pre-competitive research. In addition, through the Research Fab Microelectronics Germany (FMD), we are embedded in a larger network of R&D services that spans the entire spectrum of electronics research in Germany.

Central Research Topics of the High Performance Center

The High Performance Center has established a cross-institute platform for the core competencies of system design, components & manufacturing technologies, system integration, and reliability assessment. These core competencies are applied in particular to address the following R&D topics of high industrial relevance.:

 

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Materials & Processes for 300 mm Wafers

  • Test Wafers for Process Development in a Professional Cleanroom Environment
  • FEoL and BEoL Technologies & Analytics from a Single Source
more info
 

Thin, Heterogeneous Sensor Systems

  • Ultra-Low Profile (<500 μm) with Modular Architecture
  • Development of Wafer-Level Packages
more info
 

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Micromechanical Ultrasound Transducers

  • For distance measurement, flow measurement, imaging, and more
  • Available as an evaluation kit for your application
more info
 

Structure-Integrated Sensors

  • Wireless Communication & Power Supply (e.g., Sensor Ring)
  • Flexible Form Factor
more info

Visit our showroom

Get in touch with us:

 

Contact

Dr. Christian Körner

Head of the Office

Fraunhofer IPMS, Maria-Reiche-Str. 2, 01109 Dresden, Germany
Phone: +49 351 8823-1515

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