The High Performance Center combines the capabilities of the Fraunhofer Institutes IPMS, ENAS, IIS-EAS and IZM-ASSIS in microelectronics and microsystems R&D with the related expertise available at the Dresden University of Technology, Chemnitz University of Technology and the Dresden University of Applied Sciences.

The center constitutes a unique platform across the participating institutes with competences in systems design, components and related fabrication technologies, as well as systems integration. Based thereon, it center offers application- and customer-specific development and small series fabrication of components, integrated circuits and system-in-package (SiP-) solutions for sensors and actuators, including also their integration into e.g. machine tools.