High Performance Center »Functional Integration in Micro- and Nanoelectronics«
The development of new products based on 300 mm silicon wafer technologies requires extensive process development while adhering to high technological standards. Therefore, implementing this technology in a production line is both cost- and time-intensive. In many cases, realistic 300 mm test wafers and process modules can provide a remedy by enabling the development of new critical technology steps and device structures within a qualified development and testing environment. The same applies to the supplier industry, which provides equipment, raw materials, and auxiliaries for silicon microelectronics manufacturing. These suppliers also require access to realistic test environments where new products can be pre-qualified—ideally before being introduced to end customers.
Through the close integration of the expertise and infrastructure of IPMS and IZM-ASSID in process technology development, application-specific know-how, and available analytics, a professional environment is created for offering sophisticated and structured test vehicles and substrates. This includes Front-End-of-Line (FEoL) technologies such as high-k and epitaxial Si(Ge) layers, as well as Back-End-of-Line (BEoL) technologies. Our portfolio also includes the integration of novel spin-based or ferroelectric memory concepts, along with passive device components.
For subsequent packaging, various assembly technologies are available, ranging from flip-chip bonding to direct bonding at the Die-to-Die, Die-to-Wafer, or Wafer-to-Wafer level—including the necessary wafer preparation processes. Wafer processing includes the realization of redistribution layers with corresponding microbumps or ultra-flat direct-bond interfaces. All necessary process modules are available for 3D stacking and 3D heterogeneous integration, such as TSV integration or ultra-thin wafer processing.
Your Benefits / Our Offer:
- Support for process and product development through the provision of test wafers for 300 mm silicon fabs, tool suppliers, and materials providers
- Processes and infrastructure meeting the highest industrial standard
- Comprehensive offering of FEoL and BEoL technologies as well as advanced packaging technologies from a single source
- Resource backup to secure the supply chain and ensure quality control