High Performance Center »Functional Integration in Micro- and Nanoelectronics«
Intelligent Systems for the World of Tomorrow
The ongoing digitalization, the Internet of Things (IoT), and Industry 4.0 are driving the demand for increasingly smaller, more energy-efficient, and smarter systems. They form the nervous system of modern technology: capturing data, processing information, and triggering targeted actions. With our combined expertise – spanning fundamental materials research, design and prototype development, industrial-grade manufacturing, and system integration – we transform complex microelectronic and micromechanical concepts into market-ready innovations for biomedicine, mobility, manufacturing, and environmental technology.
Sensor and Actuator Devices: Precision at the Microscale
Our research and development focuses on high-precision components that reliably detect physical, chemical, or biological quantities and translate them into mechanical motion or digital signals.
- MEMS and NEMS sensors: Development of highly sensitive inertial, pressure, acoustic, and temperature sensors, including solutions for demanding environmental conditions.
- MOEMS & optical sensors: Development of photonic microsystems, miniaturized spectrometers, high-precision optical fiber components, as well as technologies for LiDAR sensors and optical 3D metrology.
- Microactuators & modulators: Development of high-dynamic positioning systems, micromirror arrays (Spatial Light Modulators), and innovative ultrasound transducers (MUTs).
- Chemical & biological sensing: Development of miniaturized lab-on-a-chip systems, electrochemical sensors, and environmental monitoring systems for real-time analysis.
- Intelligent system architectures: Design and simulation of sensor-actuator systems, including energy-efficient signal processing and wireless communication.
Wafer Technologies: From Substrate to System
The realization of advanced micro- and nanosystems is based on state-of-the-art wafer-level manufacturing processes. Our cleanroom infrastructures enable the flexible processing of a wide range of substrates according to industry-oriented standards, including 200 mm and 300 mm wafer platforms.
- Front-end processes: Customized lithography, etching processes (DRIE), thin-film deposition (CVD, PVD, ALD), and thermal processes for silicon, glass, and specialty materials.
- 3D system integration & heterogeneous integration: Advanced technologies for wafer-level packaging, high-density through-silicon vias (TSVs), micro-bumps, and temporary and permanent wafer bonding.
- Materials innovation: Integration of novel functional materials such as piezoelectric layers, carbon nanostructures (CNTs), and two-dimensional (2D) materials into existing CMOS processes or through heterogeneous integration.
- Analytics & quality assurance: Comprehensive non-destructive and destructive characterization, reliability testing, and inline process monitoring.
Your Benefits / Our Offering
The Micro/Nano Performance Center sees itself as a strategic development partner for industry. Through collaboration with our network, you benefit from customized solutions from a single source:
- Unique breadth of technologies: Access to complementary expertise and specialized research and manufacturing infrastructures across multiple leading research institutions – from materials and devices to system integration and testing.
- Shortened time-to-market: Seamless transfer from fundamental university research through prototype development to pilot-series manufacturing in accordance with industrial standards.
- Risk reduction: Use of existing, validated process modules and state-of-the-art design and simulation tools to reduce development risks.
- Flexible IP and collaboration models: Individually tailored contractual models for bilateral industry projects, publicly funded consortia, or feasibility studies.