Technology Transfer and Upscaling of Parylene-Aluminum-Based Redistribution Layers for Industrial Applications in Microelectronics

The project aims to establish the innovative Parylene-Aluminum (ParyAl) material system for redistribution layers (RDLs) in the field of microelectronics and packaging. The project builds on the results of previous projects, in particular the BMFTR-funded ForMikro2.0 project “UP4Foundry,” in which the ParyAl material system was established and its superiority over the polyimide-copper-based RDLs currently used in industry was demonstrated. The specific advantages include CMOS compatibility, lower loss factors for high-frequency applications, improved chemical and thermal properties, greater potential for miniaturization, lower mismatch in coefficients of thermal expansion, and better integration into existing manufacturing processes.

Although the scientific superiority of ParyAl has already been demonstrated, the crucial technology transfer required to bring the material system into industrial application is still lacking. Within the framework of the present project of the “Functional Integration for Micro/Nanoelectronics” performance center, targeted transfer measures will therefore be implemented to close the gap between research and industrial application and to establish ParyAl as a long-term standard solution.

The planned activities comprise four key areas. First, a trade fair demonstrator will be developed to showcase the technology to potential users at trade fairs and conferences. Second, a comprehensive IP and trademark strategy for the “ParyAl” brand will be developed to establish the legal and economic framework for future commercialization. Third, design rules for the material system will be derived, and datasheets and flyers will be prepared for use at trade fairs and conferences. Fourth, educational materials will be developed for use in university lectures and vocational training, with the aim of embedding knowledge of the new ParyAl material system in academic education and inspiring the next generation of engineers and scientists to engage with this forward-looking technology.

The project bridges the gap between research and application and lays the foundation for the broad industrial adoption of this innovative material system. It thereby makes an important contribution to strengthening Germany’s microelectronics sector and supports the growing demand for more powerful, reliable, and efficient packaging solutions.

Objectives

• Development of an IP and trademark strategy for ParyAl
• Development of a trade fair demonstrator
• Creation of datasheets and educational materials