High Performance Center »Functional Integration in Micro- and Nanoelectronics«
The High Performance Center Micro/Nano brings together a unique infrastructure in Europe for shaping the microelectronics of the future. This focus area centers on the research and development of novel functional materials and highly precise manufacturing processes. Our holistic research and development approach bridges the gap between materials science and industrial maturity in microelectronics and microsystems engineering (More than Moore).
Comprehensive R&D Expertise Along the Entire Value Chain
Through the close synergy of specialized cleanroom environments (200 mm and 300 mm), we cover the entire process chain seamlessly:
- Front-end innovations: Evaluation and integration of new materials directly on industry-oriented wafer platforms.
- Nanostructuring: Deposition and precise patterning of functional layers at the micro- and nanoscale for smart sensors and MEMS/NEMS.
- Heterointegration: State-of-the-art processes for advanced packaging and 3D wafer-level system integration.
Key Technology Areas at a Glance
- Next-generation material classes: Development of ferroelectric, magnetic, and nanostructured materials (e.g., carbon nanotubes) for energy-efficient memory, neuromorphic computing, and sensor technologies.
- Scalable process technologies: Development of industry-ready processes – such as atomic layer deposition (ALD) and innovative interconnect technologies – from initial laboratory designs through to transfer into high-volume production.
- Sustainable manufacturing: Research into environmentally compatible production processes for the semiconductor industry, as well as the reduction and replacement of critical chemicals (such as PFAS-regulated substances).
- Reliability and system design: Comprehensive qualification, material characterization, and reliability assessment of modular wafer systems (System-in-Package) under real-world operating conditions.
With this end-to-end approach – from atomic-scale layer design to the final packaging of the complete system – the High Performance Center Micro/Nano significantly accelerates innovation cycles for both industry and academia.
Your Benefits / Our Offering
- Processes and infrastructure meeting the highest industrial standards
- Comprehensive coverage of FEoL and BEoL technologies, MEMS and MOEMS technologies, as well as advanced packaging technologies – all from a single source
- Support for process and product development through test wafers for 200 mm and 300 mm silicon fabs, tool suppliers, and material suppliers
- Resource backup to safeguard supply chains and quality control